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| 部署・役職名 | Sr Product Engineering Manager for New Product Introduction |
|---|---|
| 職種 | |
| 業種 | |
| 勤務地 | |
| 仕事内容 |
【募集背景】 自動運転やIoTなど多様な分野において、先進的な製品やソリューションを提供しています。当社の製品は、世界中の主要な電子機器メーカーに採用され、日々の暮らしに欠かせない身の回りのあらゆる電子機器に使用されています。 同社では世界25カ国の製造・開発・販売拠点において、行動指針をもとに、互いに学習、協力、成長、目標に向けて前進しながら、日々さまざまな課題解決に取り組んでいます。 同社を取り巻く環境は近年の活発な大型M＆Aを含めて、他に類を見ないほどダイナミックに動いています。今後もインフラやデータエコノミー関連の急成長市場でのシェア拡大や、産業/IoTや自動車分野でのプレゼンス強化を図ります。変化の激しい中、グローバルチームの一員として、私たちと一緒に持続可能な将来を築いていただける方をお待ちしています。 【業務内容】 Manage team of Product Engineers for on time introduction and productization of new products by supporting package selection, package development, product qualification, product characterization, reliability assessment, manufacturability, yield entitlement and ramp readiness： ・Strong Technical leader with leadership and technical hands－on experience in semiconductor product engineering and new product development with ability to lead medium size team. ・Ability to lead and guide team of experienced and early career product engineers with day－to－day product engineering tasks related to new product development ・In depth understanding of IC and package qualification and reliability testing, qualification requirements and global quality standards such as AECQ, JEDEC and IPC standards ・Hands－on experience and functional understanding of semiconductor packaging for automotive application, assembly processes and OSAT communication and collaboration ・Ability to interface with packaging teams to help identify the right package and package design to suit the application and IC needs and participate in thorough package assessment including package level electrical, thermal and mechanical simulations and design rule checks. ・Ability to guide team to interface with quality, reliability and failure analysis teams to define optimized qualification and reliability plan for new product introduction ・Ability to guide team to perform risk assessment and define clear and detailed execution plans for PE related tasks ・Ability to collaborate with test team for defining the ATE characterization methodology for guaranteeing datasheet performance through temperature testing and for production limits and guard band setting to ensure yield and manufacturability ・Expert at data analytics needed for standard new product engineering tasks such as assessing parametric drifts during reliability testing, yield analysis and wafer test and final test and characterization data review. ・Adept at use of industry standard data analytics tools such as PDF, Spotfire, Yield watchdog etc. ・Strategic leader with ability to define package roadmap and identify areas for cost and execution and efficiency improvement ・Strong leadership with ability to set the right priorities and goals and monitor performance with the aim of nurturing and building talent and continuously improve PE execution metrics ・Ability to mentor product engineers with varying levels of experience to build a strong PE team that is able to own and independently drive PE tasks for new product introduction ・Proficient in English and Japanese with ability to communicate with Japan based team and US based leadership |
| 応募資格 |
【必須（MUST）】 【応募要件】・Bachelor’s degree in electrical engineering, Electronics, Physics or similar degree. ・5－10＋ Years’ experience in the semiconductor industry working in IC design, Product engineering, test engineering or quality and reliability type role is preferred ・3－5 years’ experience with leading or managing a team is preferred ・Package: Understand package needs for the chip and application and help identify or develop the most suitable, high performance and cost－effective package solution ・Qualification and Reliability testing: Based on IC application and customer needs, help define and optimum product qualification and reliability testing plan for IC and package qualification. Familiarity with AECQ, JEDEC and IPC global quality standards and how they apply towards determining qual requirement and track qualification progress ・Qualification Hardware: Strong understanding of HW design needed for qualification testing. Ensure no false qualification fails due to HW issues ・Execution Plan: Help team build a `bottoms －up execution plan including schedule, cost, risk and deliverables for PE related tasks ・ATE Characterization: Experience with ATE characterization, Data analysis for reviewing qualification data, Limit setting and guard banding , Cpk assessments and yield analysis ・Documentation: Create methodology and templates for PE execution planning, qual tracking and ATE characterization review |
| リモートワーク | 可 「可」と表示されている場合でも、「在宅に限る」「一定期間のみ」など、条件は求人によって異なります |
| 受動喫煙対策 | 屋内禁煙 |
| 更新日 | 2023/08/31 |
| 求人番号 | 2937489 |
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