•To design, develop and scale to volume production high voltage （600－1200V） discrete and module packages for the Industrial, Automotive, Renewable and Telecom markets.
•The candidate must utilize end equipment system requirements and build these into the definition of the package to meet electrical, thermal and mechanical specifications.
•The candidate must have the ability to define solutions across various HV technologies like Superjunction MOSFET, IGBT, Wide Bandgap and validate using CFD, thermomechanical and electrical parasitic extraction tools.
•The candidate should identify prototype/subcon partners, assess manufacturing capabilities and drive completion of 1st article builds. The candidate must also be capable of developing new process flows/technologies necessary for building prototype.
•The candidate should outline the package reliability plans, complete testing, summarize failure modes and identify fixes via or design and material selection.
•The candidate must have a broad knowledge of the material supplier landscape （mold compounds, die attach, substrates） for High voltage application and must work with various suppliers to shortlist the BOM for cost and performance.
•The candidate must be a seasoned program manager able to work in worldwide TI cross functional teams and collaborative define, develop and successfully introduce products to the market in a timely fashion.
【必須（MUST）】•BS degree in Mechanical, Material Sciences, Electrical Engineering or related engineering degree
•10＋ years of experience in High Voltage （200V－1200V must） semiconductor packaging across IGBT, Superjunction MOSFET’s, SiC technologies.
•High Voltage Discrete package and power module design （Molded and Case）, material or assembly flow development for high－voltage integrated circuits.
•Strong knowledge of High Voltage Bill of Materials （Mold compounds, Die Attach, DBC substrates etc） suppliers and their roadmaps.
•Strong knowledge of industry and subcon High Voltage packaging technologies （Molded and Case） and their roadmaps.
•Strong knowledge of silicon/GaN/SiC－package interaction and hands on experience with stress, thermal and electrical modeling analysis and tools.
•Strong Knowledge of High Voltage discrete and Power Modules reliability and qualification requirements, failure modes and mission critical profiles for end equipment’s.