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Fab23 Module Engineering Manager
年収：1000万 ～ 2000万
採用企業案件
Japan Advanced Semiconductor Manufacturing株式会社
-
- 資本金71,444百万円
- 会社規模非公開
- 電気・電子
- 半導体
| 部署・役職名 | Fab23 Module Engineering Manager |
|---|---|
| 職種 | |
| 業種 | |
| 勤務地 | |
| 仕事内容 |
■Summary： 1. Lead new technology transfers, production line set up / maintenance, team establishment, quality / productivity improvement to ensure the whole production process smoothly. 2. Elevate Engineering and Manufacturing excellence in PVD/DIF/CVD/CMP/LIT/ETCH (either one) field. ■Responsibilities： 1. Module process / equipment fundamental improvement. 2. Innovate and seize opportunities for wafer quality / productivity improvement. 3. Work with Process integration / Manufacturing / Yield improvement / Cross module team to sustain high quality wafer production / delivery. 4. Proactively identify talent and continuously develop team members with a deliberate roadmap. 5. Sustain ownership of day-to-day operations, equipment troubleshooting and mentoring engineers, Resources planning, task prioritization, and related cross-function management work. |
| 労働条件 |
Working Conditions： 1. Location - （Immediately after hiring) 4106-1 Haramizu, Kikuyou-machi, Kikuchi-gun, Kumamoto, 869-1102 (Scope of Change) Location determined by the Company 2. Working Days & Hours - 8:30～17:30 3. Benefits, Welfare - Health insurance, Employee pension, Employment insurance, Industrial accident compensation insurance, Pension plan, Retirement allowance plan, Annual leave, Commuting allowance: Actual expenses (maximum 50,000 yen/month), Housing allowance (In accordance with company's regulations) 4. Business Holiday - Saturdays, Sundays & Holidays, Vacation regulations：GW vacation, Summer vacation, Year-end and New Year vacations ※Follows the vacation regulations according to the company calendar 5. Recruitment Process - 3-4 interviews → offer ※Interview process is subject to change |
| 応募資格 |
【必須（MUST）】 ■Qualifications (Education, Skills, Certificates, etc.):1. Minimum of a Bachler degree in an engineering and scientific field such as Materials Science, Electrical Engineering, Chemical Engineering and Mechanical Engineering, or equivalent work experiences and background. 2. Minimum 8 years of experience in the semiconductor field, especially in module process development, or equivalent work experiences and background. 3. Solid technical understanding of IC processing equipment, integrated flow, chemistry and physics. 4. Exhibit good and open communication skills; be able to work within cross-functional teams, including internal and external partners. 5. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. 6. Flexibility to change priorities and responsibilities to support business needs. 7. Hands-on participant with a strong sense of ownership. 8. Willing to work in clean room. ■Languages: Japanese: Full Professional Proficiency or Native / Bilingual Proficiency English: Limited Working Proficiency or above ■Key Experience: Experience in the semiconductor industry PVD/DIF/CVD/CMP/LIT/ETCH (either one) with process and equipment knowledge. ■Personal Attributes: 1. Must be willing to relocate to Taiwan for extended period for training 2. Must be a self-starter, highly organized, and able to work well across organizations. 3. Polished presentation and interpersonal skills. 4. Good in communication and negotiation. 5. Quick assimilator of new technology. 【歓迎（WANT）】 Experience with leading company of IDM in semiconductor industry is a huge plus. |
| アピールポイント | 創立5年以内 外資系企業 シェアトップクラス 教育・研修制度充実 日系グローバル企業 ベンチャー企業 女性管理職実績あり Uターン・Iターン歓迎 新規事業 完全土日休み |
| 受動喫煙対策 | その他 「就業場所が屋外である」、「就業場所によって対策内容が異なる」、「対策内容は採用時までに通知する」 などの場合がその他となります。面接時に詳しい内容をご確認ください |
| 更新日 | 2024/03/14 |
| 求人番号 | 3374221 |
採用企業情報
- Japan Advanced Semiconductor Manufacturing株式会社
-
- 資本金71,444百万円
- 会社規模非公開
- 電気・電子
- 半導体
-
会社概要
【設立年月日】2021年12月10日
【資本金】714億4,400万円
【本社所在地】熊本県菊池郡菊陽町大字原水4106番地1
【事業内容】半導体基板処理サービスの提供、前号に付帯又は関連する一切の業務
【当社について】Japan Advanced Semiconductor Manufacturing株式会社（以下「JASM」）は、2021年11月にTSMCとソニーセミコンダクタソリューションズ株式会社（以下「SSS」）が共同で発表した、TSMCが過半数を出資する熊本県所在の子会社です。2022年の建設開始を予定しており、2024年末までに生産開始をめざします。半導体に対する世界的に旺盛な需要に対応することを目的に、月間生産能力は45,000枚（300mmウェーハ）となる見込みで、世界中の顧客にサービスを提供しています。
転職・求人情報の詳細をご覧になる場合は会員登録（無料）が必要です