|部署・役職名||Dry Etching/CVD/PVD/Copper Plating Process Expert|
＃ 仕事内容 Responsibility:
Focusing on the FEOL/BEOL process technology developing and research. It is more desirable to have experience in TSV development. Exploring and Digging out advanced TSV technology valuable opportunity and then make the related cooperation technology projects with tool vendor or material suppliers to enhance the technical capacity to lead advanced TSV technology.
1. Leading technology business planning and strategic planning. Ensure the technical direction accurate and sustainable.
2. Resides in partner companies and leads TSV process development with partner company resources. The location is scheduled to be in Miyagi Prefecture.
3. Leading technology specifications / standards / supplier technology capacity building or Proposing industry standard building and technology research projects.
【必須（MUST）】＃ Job Requirements：
1. Bachelor’s degree and above.
2. Proficient in FEOL/BEOL of semiconductor technology development and research area. Be capable to leading advanced TSV technology continuous innovation by using personal rich experience, industry resources and advanced technology methods. The experience in all Dry Etching/CVD/PVD/Copper Plating Process is preferred, although single process experience is acceptable.
3. With a strong leadership to cooperate with the surrounding multi－synergistic business units. Have personal strong influence in industry.
4. Active thinking, with a strong ability to innovate.
|アピールポイント||自社サービス・製品あり 外資系企業 女性管理職実績あり 従業員数1000人以上 シェアトップクラス 年間休日120日以上 産休・育休取得実績あり 社内公用語が英語|