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最終更新日:2026/07/28

<Gunma or Tokyo> Principal Package Engineer

応相談

研究・開発 半導体設計

半導体

群馬県

Uターン・Iターン歓迎
完全土日休み
フレックスタイム

仕事内容

1. Package Development & NPI Support   - Support package development activities for new Power MOSFET products including:      TOLL / TOLG / TOLT      Bottom-side cooled (BSC)      Dual-side cooled (DSC)      Top-side cooled (TSC)    . Advanced lead frame and clip-bond packages   - Define package requirements and specifications for new product development.   - Support package qualification and AEC-Q101 compliance activities.   - Drive package-related activities during NPI and product transition. 2. Thermal & Mechanical Engineering   - Perform thermal analysis and package characterization.   - Conduct thermal resistance and thermal impedance measurements.   - Evaluate package reliability associated with:     Power cycling     Thermal cycling     Solder joint reliability     Mechanical stress   - Support package-level failure analysis and root cause investigation. 3. Package Benchmarking & Technology Survey   - Benchmark competitor power package technologies.   - Analyze package construction, materials, and performance.   - Identify technology trends and recommend future package roadmaps.   - Conduct package reverse engineering and technical assessments. 4. Simulation & Modeling   - Develop and maintain thermal simulation models.   - Support electrical and mechanical package simulations.   - Correlate simulation results with measurement data.   - Collaborate with system engineers on thermal optimization and system-level performance evaluation. 5. Product & Customer Support   - Support customer inquiries regarding:     Thermal performance     Package selection     Reliability considerations   - Work with Application Engineering teams on customer design support.   - Develop package-related technical documentation and application notes. 6. Cross-Functional Collaboration   - Coordinate package activities with:     Design Engineering     Product Engineering     Reliability Engineering     Manufacturing     Marketing     External package suppliers   - Participate in product definition reviews and technical decision-making.

労働条件

契約期間:期間の定めなし 試⽤期間:あり(3カ⽉) 年間有給休暇日数:入社年度分の付与1日~23日(入社月で異なる)入社翌年度分の付与25日 年間休日数:132日(年間休日125日+特別休暇2日+夏休み(5日:各人の有休消化)) 社会保険:健康保険、厚⽣年⾦、労災保険、雇⽤保険 受動喫煙防⽌措置:屋内原則禁煙 【勤務地】 ルネサスエレクトロニクス株式会社 高崎事業所 群馬県高崎市西横手町111

応募資格

必須(MUST)

Thermal characterization and analysis Semiconductor package design fundamentals Reliability testing and qualification. Failure analysis techniques. Statistical data analysis. PCB and thermal design knowledge.

歓迎(WANT)

Thermal simulation tools:   ANSYS Icepak   ANSYS Mechanical   FloTHERM Familiarity with:   Automotive semiconductor requirements   AEC-Q101   APQP/PPAP

求人番号:9223475

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