転職・求人情報の詳細をご覧になる場合は会員登録（無料）が必要です
＜Gunma or Tokyo＞ Principal Package Engineer
年収：
応相談
?
採用企業案件
ルネサス エレクトロニクス株式会社
| 部署・役職名 | ＜Gunma or Tokyo＞ Principal Package Engineer |
|---|---|
| 職種 | |
| 業種 | |
| 勤務地 | |
| 仕事内容 |
1. Package Development & NPI Support - Support package development activities for new Power MOSFET products including: TOLL / TOLG / TOLT Bottom-side cooled (BSC) Dual-side cooled (DSC) Top-side cooled (TSC) . Advanced lead frame and clip-bond packages - Define package requirements and specifications for new product development. - Support package qualification and AEC-Q101 compliance activities. - Drive package-related activities during NPI and product transition. 2. Thermal & Mechanical Engineering - Perform thermal analysis and package characterization. - Conduct thermal resistance and thermal impedance measurements. - Evaluate package reliability associated with: Power cycling Thermal cycling Solder joint reliability Mechanical stress - Support package-level failure analysis and root cause investigation. 3. Package Benchmarking & Technology Survey - Benchmark competitor power package technologies. - Analyze package construction, materials, and performance. - Identify technology trends and recommend future package roadmaps. - Conduct package reverse engineering and technical assessments. 4. Simulation & Modeling - Develop and maintain thermal simulation models. - Support electrical and mechanical package simulations. - Correlate simulation results with measurement data. - Collaborate with system engineers on thermal optimization and system-level performance evaluation. 5. Product & Customer Support - Support customer inquiries regarding: Thermal performance Package selection Reliability considerations - Work with Application Engineering teams on customer design support. - Develop package-related technical documentation and application notes. 6. Cross-Functional Collaboration - Coordinate package activities with: Design Engineering Product Engineering Reliability Engineering Manufacturing Marketing External package suppliers - Participate in product definition reviews and technical decision-making. |
| 労働条件 |
契約期間：期間の定めなし 試⽤期間：あり（3カ⽉） 年間有給休暇日数：入社年度分の付与1日～23日（入社月で異なる）入社翌年度分の付与25日 年間休日数：132日（年間休日125日+特別休暇2日+夏休み（5日：各人の有休消化）） 社会保険：健康保険、厚⽣年⾦、労災保険、雇⽤保険 受動喫煙防⽌措置：屋内原則禁煙 【勤務地】 ルネサスエレクトロニクス株式会社 高崎事業所 群馬県高崎市西横手町111 |
| 応募資格 |
【必須（MUST）】 Thermal characterization and analysisSemiconductor package design fundamentals Reliability testing and qualification. Failure analysis techniques. Statistical data analysis. PCB and thermal design knowledge. 【歓迎（WANT）】 Thermal simulation tools:ANSYS Icepak ANSYS Mechanical FloTHERM Familiarity with: Automotive semiconductor requirements AEC-Q101 APQP/PPAP |
| アピールポイント | 自社サービス・製品あり 日系グローバル企業 上場企業 従業員数1000人以上 シェアトップクラス 年間休日120日以上 産休・育休取得実績あり 教育・研修制度充実 女性管理職実績あり Uターン・Iターン歓迎 完全土日休み フレックスタイム |
| 受動喫煙対策 | 屋内禁煙 |
| 更新日 | 2026/07/17 |
| 求人番号 | 9223475 |
採用企業情報
- ルネサス エレクトロニクス株式会社
転職・求人情報の詳細をご覧になる場合は会員登録（無料）が必要です